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Quantifying Simulation Errors When Idealizing the Cross Section of Microstrips

Erika Yazmin Teran Bahena (Phd Student, Instituto Nacional de Astrofisica Optica y Electronica)

Svetlana C. Sejas Garcia (Signal Integrity Engineer, ISOLA)

Reydezel Torre Torres (Researcher, Instituto Nacional de Astrofisica, Optica y Electronica)

Location: Ballroom E

Date: Thursday, January 31

Time: 9:00am - 9:45am

Track: 13. Applying Test & Measurement Methodology, 09. Measurement, Simulation & Optimization of Jitter, Noise & Timing to Minimize Errors

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

When building 3D interconnection models, rectangular cross sections are typically assumed for the traces; in the best case, a trapezoid is considered. These cases differ from the actual shape exhibited by practical interconnects because of irregular etching. This is important at low frequencies because the effective area through which the current flows is overestimated, but also at high frequencies where the skin effect confines the current to the perimeter of the trace. We assess the impact of these idealizations when simulating microstrip lines fabricated in different shops, and propose an alternative to improve modeling accuracy without significantly increasing simulation time.


• EM solvers are used for designing interconnects at multi-Gbps rates, typically assuming regular form of traces.
• However, the actual cross section differs from the regular form since imperfections are introduced by etching.
• We quantified errors in frequency and time domain simulations, and an alternative for error minimization is provided.

Intended Audience

S-parameters, eye pattern interpretation, manufacturing process, 3D EM simulations.

Presentation Files