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Reliability Challenges in Advanced Packaging

Craig Hillman (Director, Product Development)

Location: Room 203

Date: Thursday, January 30

Time: 2:50pm - 3:30pm

Track: Sponsored Session

Vault Recording: TBD

ansys

The reduction in value and relevance of Moore's Law has placed a
substantial emphasis on performance improvements through packaging.
While mostly successful, substantial pain has been experienced due to the
periodic inability to predict failures when incorporating new architectures or
new materials. These include low-K cracking, solder fatigue, microvia
separation, etc. This presentation will review the current major material
challenges that are influencing reliability discussions in electronics today at
various levels of the supply chain, including on-die, packaging, board, and
PCBA. The focus will be on the failure mechanism, how
materials/design/environment play a critical role, and implementing
workflows to successfully capture risks at design concept and final
validation.