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Signal Integrity Optimizations in a 400-Gbps Silicon Photonics Package

Jianqiang Li (Staff Optical Networking Engineer , Alibaba Group)

Anbin Wang (Senior Staff Engineer , Alibaba Group)

Chongjin Xie (Senior Director , Alibaba Group (U.S.) Inc.)

Location: Ballroom E

Date: Wednesday, January 29

Time: 2:50pm - 3:30pm

Track: 03. Integrating Photonics & Wireless in Electrical Design, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging

Format: Technical Session

Pass Type: 2-Day Pass, All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

Silicon photonics is a promising technology for high-speed optical interconnects due to advantages in footprint, power consumption and cost, but it also brings challenges for Multi-die package design.
This paper investigates design challenges and tradeoffs, and presents an efficient signal integrity design and optimization flow for a 400-Gbps multi-die silicon photonics integration package. A simple VIA equivalent circuit is generated and used for system optimizations. After optimizations, the performance of the package is greatly improved on impedance continuity, insertion loss and reflections. The design and optimization considerations not only improve the design cycle, but also help on overall system performance evaluations.

Takeaway

Silicon photonics is a promising technology for high-speed optical interconnects due to advantages in footprint, power consumption and cost, but also brings challenges for Multi-die package design. This paper investigates design challenges and tradeoffs, and presents an efficient signal integrity design and optimization flow for a 400-Gbps multi-die integration package.

Intended Audience

The audience should have a basic Signal Integrity understanding, such as transmission line theory.