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Signal Integrity Simulation and Measurement Correlation: Getting Smart with Beatty Standard

Mike Resso (Signal Integrity Application Scientist, Keysight Technologies)

Chun-ting "Tim" Wang Lee (Application Engineer for High Speed Digital Applications in the EEsof EDA Group, Keysight Technologies)

Location: Great America 1

Date: Wednesday, January 29

Time: 9:20am - 10:05am

Track: Keysight Education Forum

Vault Recording: TBD

This presentation helps you improve your understanding of Signal Integrity simulation and measurement correlation by reviewing and re-introducing Beatty Standard test structure. The fabrication process of Printed Circuit Board (PCB) introduces uncertainties in different aspects of the circuit board. By modeling and tuning the PCB properties of Beatty Standard test structure in simulation to match measurement, SI engineers identify the as-fabricated material properties. This presentation first reviews the PCB material property identification process, follows with a new theoretical analysis of Beatty Standard that showcases the versatility and accuracy of the test structure, and concludes with a measurement to simulation workflow for PCB material properties identification.
If you are new to signal integrity, this session gives you a comprehensive view of what it takes to achieve simulation and measurement correlation. For experienced SI engineers, this presentation is an excellent review and update on the development of PCB material property identification.