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Signal/Power Integrity Optimizations in an IoT Automotive Package

Ben Silva (Analog Engineer, Intel Corporation)

Yan Fen Shen (Analog Engineer, Intel Corporation)

Mohamed Eldessouki (Analog Engineer, Intel Corporation)

Location: Ballroom A

Date: Thursday, January 31

Time: 10:00am - 10:45am

Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging, 04. System Co-Design: Modeling, Simulation & Measurement Validation

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

Demand for connected smart vehicles has increased exponentially in recent years and this includes the SoC package that powers the vehicle's sub-systems. The thermal, reliability, and life-cycle use conditions dictate many physical design aspects of the SoC. These physical design elements prove detrimental to both signal and power integrity, limiting the SoC's speeds and capabilities. Signal and power integrity mitigations strategies directly oppose one another, so it becomes necessary to balance both disciplines to provide the best possible overall system performance. This paper investigates the challenges, tradeoffs, compromises, and results in the design of an automotive SoC package.


Harsh operating environments drive design decisions that impinge signal and power integrity performance. Mitigation options for SI and PI directly oppose one another, necessitating a close cooperation between SI and PI design efforts to optimize performance from a full-system perspective rather than to work in isolated silos.

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