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Simplify & Validate: A Single Structure Approach for Separate PCB Dielectric & Conductor Roughness Loss Characterization

Yasin Damgaci (Signal Integrity Engineer, Hewlett Packard Enterprise)

YongJin Choi (Master Technologist, Hewlett Packard Enterprise)

Christopher Cheng (Distinguished Technologist, Hewlett Packard Enterprise)

Yuriy Shlepnev (President , Simberian Inc.)

Nagaraj Godishala (Master Technologist, Hewlett Packard Enterprise Company)

Location: Ballroom B

Date: Thursday, January 31

Time: 10:00am - 10:45am

Track: 14. Modeling & Analysis of Interconnects

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

To find out the reasons for possible PCB manufacturing failure due to losses, a new easy-to-use production floor technique with separation of dielectric, conductor and roughness effects is needed. This paper presents a novel method that identifies material properties using just one structure and one TDR/TDT measurement. The post-processing of the measurement extracts the frequency-dependent models for dielectric, conductor, and copper surface roughness. The proposed technique is called XMOT (eXtract and MOnitor PCB material properties using a T-resonator only). It can be used to collect the statistics of the material variations during manufacturing and monitor changes in dielectric and conductor roughness properties.


We are proposing a novel method which identifies material properties and differentiates conductor and dielectric losses using one structure only: asymmetrical T-resonator. This approach requires only one measurement in the time-domain. Just using one structure we can get information on transmission line properties and resonator response at the same time.

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