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DesignCon 2019 Presentation Viewer

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Skew Measurement of High-speed Connector

Zhongmin Wei (SI Engineer, ZTE Corporation)

Maoxiang Wei (SI Engineer, ZTE Corporation)

Shunlin Zhu (Chief Engineer, ZTE Corporation)

Bi Yi (SI Engineer, ZTE Corporation)

Zachary Su (FAE Manager, Xpeedic)

Location: Ballroom A

Date: Thursday, January 31

Time: 9:00am - 9:45am

Track: 14. Modeling & Analysis of Interconnects, 13. Applying Test & Measurement Methodology

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

High-speed Connector is a critical component in high-speed serial system,whose skew directly affects the system's performance. A Method to obtain skew based on Impulse response of Insertion Loss and Return Loss is introduced. Combined with a simple mathematical subtraction,the accurate measurement data of high-speed Connector's skew can be extracted by totally removing fixture's influence. Meanwhile, a new mix lamination is adopted to lower PCB trace's skew.With which the fixture's skew is reduced to guarantee the accuracy of measurement S parameter of connector.


With this method,we can totally remove the skew of fixtures, Also a new stackup is adopted to reduce skew of PCB trace .without any specific limitation.

Intended Audience

SI Engineer