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Solving PCI Express Issues Spanning Physical and Protocol Layers

Patrick Connally (Technical Marketing Engineer, High Bandwidth Oscilloscopes, Teledyne LeCroy)

Location: Mission City M2

Date: Wednesday, January 30

Time: 11:05am - 11:45am

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD

Teledyne LeCroy

Modern serial links use advanced techniques such as dynamic link equalization to address the challenges of transferring high-speed data over lossy channels and interconnects. These techniques involve protocol-layer negotiations between devices in order to optimize their physical-layer behavior for the signal environment. This seminar explains how PCI Express devices implement these operations, how they are tested, and illustrates unique combinations of Teledyne LeCroy protocol- and physical-layer toolsets for powerful debug capabilities.