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Solving PCI Express Issues Spanning Physical and Protocol Layers
Patrick Connally (Technical Marketing Engineer)
Location: Mission City M3
Date: Thursday, January 30
Time: 2:50pm - 3:30pm
Track: Sponsored Session
Vault Recording: TBD
Modern serial links use advanced techniques such as dynamic link equalization to address the challenges of transferring high-speed data over lossy channels and interconnects. These techniques involve protocol-layer negotiations between devices in order to optimize their physical-layer behavior for the signal environment.
This seminar explains how PCI Express devices implement these operations, how they are tested, and illustrates unique combinations of Teledyne LeCroy protocol- and physical-layer toolsets for powerful debug capabilities.