DesignCon is part of the Informa Markets Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.


Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Solving PCI Express Issues Spanning Physical and Protocol Layers

Patrick Connally (Technical Marketing Engineer)

Location: Mission City M3

Date: Thursday, January 30

Time: 2:50pm - 3:30pm

Track: Sponsored Session

Vault Recording: TBD

Teledyne Lecroy

Modern serial links use advanced techniques such as dynamic link equalization to address the challenges of transferring high-speed data over lossy channels and interconnects. These techniques involve protocol-layer negotiations between devices in order to optimize their physical-layer behavior for the signal environment.

This seminar explains how PCI Express devices implement these operations, how they are tested, and illustrates unique combinations of Teledyne LeCroy protocol- and physical-layer toolsets for powerful debug capabilities.