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DesignCon 2019 Presentation Viewer

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Solving PCI Express Issues Spanning Physical and Protocol Layers

Patrick Connally (Technical Marketing Engineer, High Bandwidth Oscilloscopes, Teledyne LeCroy)

Location: Mission City M2

Date: Wednesday, January 30

Time: 11:05am - 11:45am

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD

Teledyne LeCroy

Modern serial links use advanced techniques such as dynamic link equalization to address the challenges of transferring high-speed data over lossy channels and interconnects. These techniques involve protocol-layer negotiations between devices in order to optimize their physical-layer behavior for the signal environment. This seminar explains how PCI Express devices implement these operations, how they are tested, and illustrates unique combinations of Teledyne LeCroy protocol- and physical-layer toolsets for powerful debug capabilities.