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System Planning and Management for 3D Designs

TV Narayanan (Senior Principal Product Manager, Cadence)

Location: Great America 3

Date: Thursday, January 31

Time: 3:45pm - 4:25pm

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD

Cadence Design Systems

With semiconductor processing capabilities improving and the need for integrating different functional blocks in a small form factor, the cost factor of using 3D stacked ICs for product design is looking all the more realistic. This necessitates the need for new design flows and creates the space for EDA tools to tackle the issue of connectivity planning and management at the system level. This talk will explore the way OrbitIO solves this problem amongst others through a unified canvas for chip, package and board co-design.