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Thermal Issues and Solutions for 3D ICs: Latest Updates and Future Prospect

Sung-Kyu Lim  ( Professor, School of Electrical and Computer Engineering, Georgia Institute of Technology)

Location: Room 203

Date: Wednesday, January 29

Time: 2:50pm - 3:30pm

Track: Sponsored Session

Vault Recording: TBD

Ansys

It is well-known that thermal issues have been the most prominent roadblock hindering the mainstream acceptance of 3D IC technology. This has called for a concerted effort from all parts of the community: architects, circuit designers, electronic design automation (EDA) vendors, foundries, and packaging houses. In this talk, we present our latest research accomplishments from circuit design and EDA perspectives. Specifically, we provide detailed thermal analysis results of commercial-grade 3D IC designs targeting a wide range of applications. We analyze the root causes of their thermal hotspots and their impact on power, performance, and area (PPA). Next, we discuss which set of thermal-aware design and EDA solutions have been useful to mitigate thermal hotspot issues. We conclude with our thoughts on the need for multi-disciplinary and multi-faceted efforts. This project is currently being funded by DARPA, Arm, and Ansys.