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Thermal & SI/PI Co-Analysis to Quantify PCB Signal Loss Due to Temperature Variation

Xiaoning Ye (Principal Engineer, Intel Corp)

Hongfei Yan (Principal Engineer, Intel Corp)

Yinglei Ren (Technical Lead (SI Engineer), Intel Corp)

Chunfei Ye (Technical Lead (SI Engineer), Intel Corp)

Location: Ballroom C

Date: Thursday, January 31

Time: 2:50pm - 3:30pm

Track: 14. Modeling & Analysis of Interconnects, 04. System Co-Design: Modeling, Simulation & Measurement Validation

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

Our recent study showed PCB loss is very sensitive to temperature variation. However, the temperature distribution is non-uniform across the board, yet many system design factors impacts the temperature profile. The temperature impact on signal loss highly depends on the routing path. A general practice is to assign certain guard-band for the loss increase due to temperature impact under some worst case conditions. This often results in over-guard-band. In this paper, a Thermal/PI/SI co-analysis method is outlined to provide a customized analysis of thermal impact on PCB signal loss, for any given signal routing path within a given system.

Takeaway

In this paper, a Thermal/PI/SI co-analysis method is outlined to provide system-level customized analysis of thermal impact on PCB signal loss. The step-by-step flow of co-analysis is detailed, and new algorithms are developed to facilitate cross-domain simulation.

Intended Audience

some basic understanding of PCB loss, signal integrity, power integrity and thermal analysis

Presentation Files

SLIDES_14_ThermalSIPICoAnalysistoQuantify_Yan.pdf
PAPER_14_ThermalSIPICoAnalysistoQuantify_Yan.pdf