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DesignCon 2019 Presentation Viewer

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Thermoelectric Performance of Copper Clad Laminate

Mark Shields (Director of OEM Marketing & Sales: North America, Nan Ya Plastics)

Location: Ballroom F

Date: Thursday, January 31

Time: 9:00am - 9:45am

Track: 05. Advances in Materials & Processing for PCBs, Modules & Packages

Session Type: Technical Session

Vault Recording: TBD

Audience Level: All

The demand for higher frequency and faster data transmission rates is rapidly increasing. A consequence of this trend is a higher temperature operating environment.

For high frequency copper clad laminates (CCL) the relationship between temperature and electrical performance of printed circuit boards (PCBs) has been investigated from room temperature to 100°C. (CPU operating temperature at 70-80℃).

Resin types tested include epoxy resin, phenolic resin, hydrocarbon, polyphenylene ether (PPE) and polytetrafluoroethylene (PTFE). There is a correlation between electrical performance and operating temperature.

Takeaway

Higher operating temperatures affect electrical performance stability of printed circuit board materials. Test results quantify thermoelectric stability of standard loss, mid loss, low loss and ultra low loss material types.

Intended Audience

Higher operating temperatures affect electrical performance stability of printed circuit board materials. Test results quantify thermoelectric stability of standard loss, mid loss, low loss and ultra low loss material types.