April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

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Three Very Low-cost Technology Solutions for SI Applications


Eric Bogatin  (Professor, University of Colorado, Boulder)


Melinda Piket-May  (prof, CU)

Aditya Rao  (Grad student, CU)

Julio Puentes  (Undergraduate, CU)

Location: Ballroom H

Date: Wednesday, April 6

Time: 3:00 pm - 3:45 pm

Track: 12. Applying Test & Measurement Methodology, 04. Advances in Materials & Processing for PCBs, Modules & Packages

Format: Technical Session

Theme : High-speed Communications

Education Level: Introductory

Pass Type: 2-Day Pass, All Access Pass

Vault Recording: TBD

Audience Level: Introductory

One of the research activities of the High-Speed Digital Engineering Group at the University of Colorado, Boulder, is developing very low-cost technology solutions for signal integrity applications. We show four of these projects. One is designing optimized launches using low cost SMA connectors that can operate up to 15 GHz. Another project is to extract the Dk of a PCB layer using a special test structure and TDR measurements. The third project is generating a 5 Gbps PRBS signal for $5. The fourth project is measuring the bandwidth of a scope-probe system up to 2 GHz with a $60 source.


Sometimes, it is possible to find an acceptable compromise between good enough, high enough bandwidth and low cost. We offer a few examples.

Intended Audience

We present four very low-cost solutions to SI problems: SMA launches to PCB traces for $0.35 with a 15 GHz bandwidth, a simple Dk measurement with a TDR using one test structure, generating 5 Gbps PRBS signal for $5 and measuring the insitu bandwidth of a scope and its probes.