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Tutorial – Design Insights from Electromagnetic Analysis & Measurements of PCB & Packaging Interconnects Operating at 6- to 112-Gbps & Beyond

Yuriy Shlepnev  (President, Simberian Inc.)

Vadim Heyfitch  (Signal Integrity Engineer, Sr. MTS, Package Developement Group, Xilinx)

Location: Ballroom C

Date: Tuesday, January 28

Time: 1:30 pm - 4:30 pm

Track: 13. Modeling & Analysis of Interconnects

Format: Tutorial

Pass Type: All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: Intermediate

Successful design of interconnects means that all links operate at the target data rate on the first pass, without time consuming re-spins and tedious troubleshooting. What does it take to succeed? We review various analysis techniques and aspects of design process for interconnects operating at 6-112 Gbps and rank them by significance, risk, or impact on obtaining a working design. We discuss multiple case studies that involve both analysis and measurements. We will provide analysis of what should be done to further extend the data rates and how interconnects of the future should look like.


Better understanding of the signal degradation mechanisms in PCB/packaging interconnects with increased data rates and signal bandwidth. Learn what is important to know and how to design predictable PCB/packaging interconnects and to avoid design re-spins.

Intended Audience

Basic Signal Integrity.

Presentation File