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Tutorial – Introduction to the IEEE P370 Standard & Its Applications for High Speed Interconnect Characterization

Xiaoning Ye (Principal Engineer, Intel Corp)

Jay Diepenbrock (Consultant, SIRF Consultants, LLC)

Heidi Barnes (Senior Application Engineer, Keysight)

Eric Bogatin (Signal Integrity Evangelist, Teledyne LeCroy)

Mikheil Tsiklauri (Research Professor, Missouri University of Science and Technology)

Jason Ellison (Senior Staff SI Engineer, Amphenol)

Se-Jung Moon (Analog Circuit Engineer, Intel)

Jose Moreira (Senior Staff Engineer, Advantest)

Ching-Chao Huang (President, AtaiTec Corporation)

Location: Ballroom B

Date: Tuesday, January 28

Time: 1:30pm - 4:30pm

Track: 12. Applying Test & Measurement Methodology

Format: Tutorial

Pass Type: All-Access Pass, Alumni All-Access Pass - Get your pass now!

Vault Recording: TBD

Audience Level: All

As high speed interconnect data rates increase, the need for quality interconnect measurements becomes critical. However, standard practices are lacking on how to measure PCB and related interconnects at high frequencies. IEEE P370 standard was developed to address this issue from three key aspects: the requirement of a high quality fixture design; the verification of de-embedding tools and practices in lab; the validation of the integrity of generated S-parameters. The tutorial will provide an overview of the standard, and then demonstrate how to apply it to practical high speed interconnect design characterization.

Takeaway

In this tutorial we will present the IEEE P370 standard (expected to finish balloting September 2019), its key components and how they can be applied to the industry challenges of characterizing printed circuit board (PCB) and related interconnects at high frequencies up to 50 GHz.