April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Speaker:
Jose Moreira (Senior Staff Engineer, Advantest)
Location: Ballroom D
Date: Tuesday, April 5
Time: 2:00 pm - 4:30 pm
Track: 03. Integrating Photonics & Wireless in Electrical Design
Format: Tutorial
Theme : 5G
Education Level: All
Pass Type: All Access Pass
Vault Recording: TBD
Audience Level: All
In this tutorial we will discuss the challenges of testing antenna in package modules for 5G applications with automated test equipment in high-volume manufacturing. We will start with an introduction to Antenna in package modules and the corresponding antenna arrays and the antenna array characterization techniques defined in the 3GPP 5G standard. We will then discuss the challenges of using these techniques in a standard test cell and why a different procedure is needed. We will follow-up with a discussion on the different possible approach for high-volume over the air testing: Reactive near-field, radiating near-field and far field with a comparison of the advantages and disadvantages of each option using a demo antenna in package module as a comparison vehicle. A discussion on the typical test in volume production will also be presented (EVM, P1dB, etc...). We will conclude with a discussion on the different options of mechanical integration in the test cell handler and also a discussion on the test fixture/socket requirements.
What methodologies are possible to use for high-volume testing of antenna in package modules that can be implemented in a standard automated test equipment test cell with the needed failure coverage and cost of test level.