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Tutorial – Recent Advances in Extracting DK, DF & Roughness of PCB Material

Jayaprakash Balachandran (Technical Lead, Cisco)

Kevin Cai (Technical Lead, Cisco)

Anna Gao (Signal Integrity Intern, Cisco)

Bidyut Sen (Principal Engineer, Cisco)

Pin Jen Wang (Signal Integrity Engineer, Hirose Electric)

Jeremy Buan (Signal Integrity Manager, Hirose Electric)

Ching-Chao Huang (President, Ataitec)

Clement Luk (Signal Integrity Engineer, Samtec)

Location: Ballroom D

Date: Tuesday, January 29

Time: 9:00am - 11:50am

Track: 05. Advances in Materials & Processing for PCBs, Modules & Packages

Session Type: Tutorial

Vault Recording: TBD

Audience Level: All

The ability to accurately predict insertion and return losses of PCB structures before and after mass production is of utmost importance to the fab houses and their customers. To facilitate such prediction, this tutorial presents the recent development of extracting dielectric constant (DK), dissipation factor (DF) and surface roughness of PCB material. PCB trace-only data were extracted by both Delta-L and de-embedding methods from transmission line structures of different lengths and then fitted by a 2D field solver. New findings to be discussed include how the geometric model, return los, skew and temperature affect the extracted material property. Actual industry data will be used to show how an automated PCB extraction framework can be deployed in large-scale manufacturing for quality control and to aid material selection during the system design stage.

Takeaway

A comprehensive tutorial for PCB material extraction is
presented. Audience will learn about the recent
development of extracting Dk, Df and roughness for advanced
material.

Intended Audience

No