DesignCon is part of the Informa Markets Division of Informa PLC

This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.

Early Bird Registration Now Open till November 30th. Save Up to $300 Today!

DesignCon 2019 Presentation Viewer

Purchase procecdings

Welcome to the DesignCon Presentation Store. Here you can view and download conference and/or show floor theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, note that it’s likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

If you’d like to do a bulk download of all conference presentations or technical papers at once, please click here for conference presentations or click here for full technical papers. For sessions not included in the main conference, click here for Chiphead Theater presentations or click here for sponsored session presentations.

Tutorial – Recent Advances in Extracting DK, DF & Roughness of PCB Material

Jayaprakash Balachandran (Technical Lead, Cisco)

Kevin Cai (Technical Lead, Cisco)

Anna Gao (Signal Integrity Intern, Cisco)

Bidyut Sen (Principal Engineer, Cisco)

Pin Jen Wang (Signal Integrity Engineer, Hirose Electric)

Jeremy Buan (Signal Integrity Manager, Hirose Electric)

Ching-Chao Huang (President, Ataitec)

Clement Luk (Signal integrity engineer, Samtec)

Location: Ballroom D

Date: Tuesday, January 29

Time: 9:00am - 11:50am

Track: 05. Advances in Materials & Processing for PCBs, Modules & Packages

Session Type: Tutorial

Vault Recording: TBD

Audience Level: All

The ability to accurately predict insertion and return losses of PCB structures before and after mass production is of utmost importance to the fab houses and their customers. To facilitate such prediction, this tutorial presents the recent development of extracting dielectric constant (DK), dissipation factor (DF) and surface roughness of PCB material. PCB trace-only data were extracted by both Delta-L and de-embedding methods from transmission line structures of different lengths and then fitted by a 2D field solver. New findings to be discussed include how the geometric model, return los, skew and temperature affect the extracted material property. Actual industry data will be used to show how an automated PCB extraction framework can be deployed in large-scale manufacturing for quality control and to aid material selection during the system design stage.


A comprehensive tutorial for PCB material extraction is
presented. Audience will learn about the recent
development of extracting Dk, Df and roughness for advanced

Intended Audience