Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.
Ben Jordan (Sr Manager, Corporate Marketing, Altium LLC)
Location: Ballroom A
Date: Tuesday, January 28
Time: 9:00am - 12:00pm
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Tutorial
Pass Type: All-Access Pass, Alumni All-Access Pass - Get your pass now!
Vault Recording: TBD
Audience Level: Introductory
This is a session for embedded engineers and PCB designers who have never done RF board layout, but are curious and want to have a go at it. It is not for experienced microwave engineers. This is a practical workshop, and will introduce (or re-introduce) some of the basic math associated with the topic, but the goal is to be practical and intuitive, not theoretical and esoteric. We will visualize the elements available and build and test using desktop prototyping gear.
Attendees will leave this class with:
(1) A better understanding of the physical transmission line structures used for microwave boards
(2) Essential transmission line evaluation skills (VSWR, S-parameters, basic simulation)
(3) Ability to design basic transmission line elements: T-Line, Impedance Transformer, Stubs
(4) An introductory knowledge of PCB antennas
(5) Smith charting tools.
High school physics :-)