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DesignCon 2019 Presentation Viewer

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USB Type-C Technologies Physical and Protocol Layer Testing

Mike Engbretson (Applications Engineer, Teledyne LeCroy)

Location: Mission City M2

Date: Wednesday, January 30

Time: 8:05am - 8:45am

Track: Sponsored Sessions

Session Type: Sponsored Session

Vault Recording: TBD

Teledyne LeCroy

The USB Type-C™ Connector is gaining momentum in the PC Industry. The latest technologies under development over the USB Type-C connector offers Power Delivery, USB3.2 (10Gb/s), DisplayPort1.4 (8.1Gb/s), and Thunderbolt3 (20Gb/s), as well as other proprietary ‘Alt Modes’ and faster date rates in the future. A simple, reversible connector carrying multiple protocols, provides end users with a tremendous user experience. However what’s simple for the end user; creates new and complex test challenges for developers.

This session will be a high level overview of Physical Layer testing of USB3.2, DisplayPort 1.4, and Thunderbolt3 over the USB Type-C connector using Teledyne LeCroy Oscilloscopes, Protocol Analyzers and partner solutions.