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DesignCon 2020 Schedule Builder
Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.
Mike Engbretson (Product Manager - High Speed Oscilloscope Solutions, Teledyne LeCroy)
Location: Mission City M3
Date: Thursday, January 30
Time: 11:05am - 11:45am
Track:
Sponsored Session
Vault Recording: TBD
The USB4 Specification (recently released by the USB-IF) introduces next generation features and performance for USB hosts, devices, and hubs. Using the existing USB-Câ„¢ Cables and Physical Layer Specification from Thunderbolt 3; USB4 designs will rapidly find their way into new products in 2020. USB4 acheives up to 40Gbs (2 lanes at 20Gb/s) electrical throughput, supports USB Power Delivery and DisplayPort all over a small form factor flippable connector. While the USB4 interface is designed to be easy for the end user, its architecture presents new challenges for high speed digital design engineers.
This session will be a high level overview of USB4 Electrical and Protocol Compliance Testing and Debug using Teledyne LeCroy Oscilloscopes, Protocol Analyzers, and partner solutions.
