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USB4™ Physical and Protocol Layer Testing

Mike Engbretson  (Product Manager - High Speed Oscilloscope Solutions, Teledyne LeCroy)

Location: Mission City M3

Date: Thursday, January 30

Time: 11:05am - 11:45am

Track: Sponsored Session

Vault Recording: TBD

Teledyne Lecroy

The USB4 Specification (recently released by the USB-IF) introduces next generation features and performance for USB hosts, devices, and hubs. Using the existing USB-C™ Cables and Physical Layer Specification from Thunderbolt 3; USB4 designs will rapidly find their way into new products in 2020. USB4 acheives up to 40Gbs (2 lanes at 20Gb/s) electrical throughput, supports USB Power Delivery and DisplayPort all over a small form factor flippable connector. While the USB4 interface is designed to be easy for the end user, its architecture presents new challenges for high speed digital design engineers.

This session will be a high level overview of USB4 Electrical and Protocol Compliance Testing and Debug using Teledyne LeCroy Oscilloscopes, Protocol Analyzers, and partner solutions.