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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Subas Bastola is currently a Technical Lead at Intel Corporation, working on signal integrity of high-speed interconnects in Server systems. He received his Bachelor degree in communication engineering from Royal Melbourne Institute of Technology (RMIT) - Australia and Masterâ€™s degrees in electronics engineering from National University of Singapore, in 1994 and 1998, respectively. He has published over 25 IEEE and other technical papers and holds 3 patents.