April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Idan Ben EzraHardware & PI EngineerBroadcom Semiconductors

Idan Ben Ezra is a Hardware and PI engineer at Broadcom Semiconductors, DNX group of CSG-Switch Products, in Israel. In Broadcom Idan is a Focal point in full system Power Delivery Network analysis design stages: Develop PI co-simulations and automation flow to cover corner cases (together & separate) for Board (from VRM), Socket, Package & Interposer (Die with HBMs) - IR drop, PDN & Transient response simulation. Review and guidance regarding Power improvements on design stages– loop inductance paths, Planes, Vias, Caps (values & size), etc. Hands-on experience in power measurements (PDN, voltage noise, Load-Line solution, etc.) then comparison to simulations. In his past, he worked at Valens where he was instrumental in Board design and Simulation engineer for high-speed automotive chips, also an investigation of unique and undocumented phenomena of Valens's chips. Idan Ben Ezra holds a Practical Electrical Engineer & Bachelor's degree in Electronics and Computers Engineering from HIT, graduated with honors.