DesignCon 2022 Schedule Builder

Teng-Kai (Kyle) Chen is a Principal Hardware Engineer at Mirosoft Corporation. He is responsible for signal integrity and power integrity for Microsoft Hololens and focuses on simulation to lab correlation for high-speed serial links and power delivery network (PDN) automation and optimization. He received his B.S. degree in Electrical Engineering from National Cheng Kung University, Tainan, Taiwan, in 2004, M.S. degree in Communication Engineering from National Taiwan University, Taipei, Taiwan, in 2006. Upon graduation and mandatory military service, he worked two years as a signal integrity engineer at MediaTek in Hsinchu, Taiwan. He received his Ph.D. degree in Electrical and Computer Engineering from Texas A&M University, College Station, TX, USA, in 2012. Prior to joining Microsoft in 2018, he was Sr. Electrical Project Engineer at Molex LLC., Fremont, CA, from 2014 to 2018, where he was working on designing connectors toward 56Gbps and 112Gbps high speed applications, and Member of Research Staff at Fujitsu Laboratories of America, Sunnyvale, CA, from 2013 to 2014, where he was working on deep learning algorithms for neuromorphic hardware and Artificial Intelligence (AI) applications, and research and development of high-speed platform technology. His research interests include signal and power integrity, microwave/optical/nano antenna, metamaterials, transformation optics, radio frequency (RF) desensitization, and electromagnetic interference (EMI).

Presenting:

• Encore Presentation: Optimizing Interconnect Through Application of Bayesian Optimization Utilizing 3D EM Solvers
• Optimal Design of High-Speed Flexible Interconnectors by Applying Bayesian Optimization & 3D Electromagnetic Solvers