designcon is part of the Informa Markets Division of Informa PLC
This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.
April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Qian Ding is a packaging R&D Engineer with Intel PSG. She holds an MS degree from UC San Diego on Analytical Electromagnetics. Her current focuses include high-speed 2.5D interconnect modeling and Package architecture pathfinding.