April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Qian DingDesign EngineerIntel

Qian Ding is a packaging R&D Engineer with Intel PSG. She holds an MS degree from UC San Diego on Analytical Electromagnetics. Her current focuses include high-speed 2.5D interconnect modeling and Package architecture pathfinding.