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Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Jinsong HuPrincipal Application EngineerCadence

Jinsong Hu is a Principal Application Engineer at Cadence Corporation. He has 15yrs+ of experience working in signal integrity and power integrity area, covering EDA tool, SoC and client products. He has worked for Sigrity and Intel before 2013. His expertise area is chip, package and board high-speed design, signal integrity, power integrity and thermal technologies. His recent work includes 3DFEM modeling, 2.5D interposer SI/PI modeling and thermal simulations.