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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
DongHyun (Bill) Kim received B.S., M.S. and Ph.D. degrees in electrical engineering from Korea Advanced Institute of Science and Technology (KAIST), Daejeon, Republic of Korea, in 2012, 2014 and 2018, respectively. In 2018, he joined the Missouri University of Science and Technology (formerly University of Missouri-Rolla), Rolla, MO, USA, and is currently an Assistant Professor with the Missouri S&T EMC Laboratory, Rolla, MO, USA. His current research interests include nanometer-scale devices, through-silicon via (TSV) technology and signal integrity (SI), power integrity (PI), temperature integrity (TI), electromagnetic compatibility (EMC) and electrostatic discharge (ESD) in 2.5D/3D IC systems.