April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Joungho KimProfessorKorea Advanced Institute of Science and Technology

Joungho Kim (Fellow, IEEE) received the B.S. and M.S. degrees from Seoul National University, Seoul, South Korea, in 1984 and 1986, respectively, and the Ph.D. degree from the University of Michigan, Ann Arbor, MI, USA, in 1993, all in electrical engineering. He joined the Memory Division, Samsung Electronics, Suwon, South Korea, in 1994, where he was involved in a gigabit-scale DRAM design. In 1996, he joined the Korea Advanced Institute of Science and Technology (KAIST), Daejeon, South Korea, where he is currently a Professor with the Department of Electrical Engineering. He is also the Director of the 3-D Integrated Circuit (IC) Research Center supported by SK Hynix, Inc., Icheon, South Korea, and the Smart Automotive Electronics Research Center supported by KET, Inc., Incheon, South Korea. He has given more than 219 invited talks and tutorials in academia and related industries. He has authored or coauthored more than 404 technical articles in refereed journals and conference proceedings. He has authored a book titled Electrical Design of Through-Silicon-Via (Springer, 2014). In particular, his major research interests include chip package printed circuit board (PCB) co-design and co-simulation for signal integrity, power integrity, ground integrity, timing integrity, and radiated emission in 3-D integrated circuit (IC), through-silicon via (TSV), and interposer. His current research interests include electromagnetic compatibility (EMC) modeling, design, and measurement methodologies of 3-D IC, TSV, interposer, system in package, multilayer PCB, and wireless power transfer (WPT) technology for 3-D IC.