April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Michael KlempaElectrical EngineerAmphenol ICC

Michael Klempa is an Electrical Engineer at Amphenol ICC designing 400G+ Optics. He is currently serving as the Optical Interconnect Forum’s (OIF) Interoperability Physical Link Layer Chair. He contributes to the 802.3 Working Group, including editing the 802.3bz specification. Previously he was a Technical Manager at the University of New Hampshire InterOperability Laboratory (UNH-IOL). He obtained his Bachelors of Science in Electrical Engineering in 2013 and his Masters in Electrical Engineering in 2017. He has participated on panels at DesignCon and has works published in EDN Network.