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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Michael Klempa is an Electrical Engineer at Amphenol ICC designing 400G+ Optics. He is currently serving as the Optical Interconnect Forumâ€™s (OIF) Interoperability Physical Link Layer Chair. He contributes to the 802.3 Working Group, including editing the 802.3bz specification. Previously he was a Technical Manager at the University of New Hampshire InterOperability Laboratory (UNH-IOL). He obtained his Bachelors of Science in Electrical Engineering in 2013 and his Masters in Electrical Engineering in 2017. He has participated on panels at DesignCon and has works published in EDN Network.