April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA


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Billy KooPrincipal engineerSamsung Electronics

Billy(Kyounghoi) Koo received B.S. and M.S. degrees in electrical engineering from Chungbuk National University, Korea in 1996 and 1998, respectively with focus on high speed I/O transceiver. In 1998, he joined SAMSUNG Electronics where he was designed and developed high-speed peripheral interfaces such as PCI-X, AGP, HSTL, SSTL, LVDS and USB2.0. From 2004 to current, he was responsible for the developing high-speed memory interface circuits for native DDR2/DDR3/DDR4, mobile LPDDR2/LPDDR3/LPDDR4/LPDDR5 and high bandwidth GDDR6/HBM. He holds over 10 U.S. and foreign patents, and published 6 papers and conference contributions in analog/digital mixed signal design and high-speed interface area. He wins DesignCon2020 best paper awards.

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