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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Beomtaek Lee joined Intel in 1997. He is currently a senior principal engineer in Data Center Group (DCG). He worked on power delivery and EMC design for Pentium®II, Pentium®III and Pentium®4, front side bus (FSB) development for Itanium®2 and Xeon® processors, external memory interface (XMI), Scalable Memory Interconnect (SMI) and Intel® QuickPath Interconnect (QPI) developments for Intel datacenter platforms. He has been working on PCI Express, Intel® Ultra Path Interconnect (UPI), Ethernet, Intel® Omni-Path Fabric Interconnect and Optical interconnect developments for Intel datacenter platforms. He received his Ph.D. in electrical engineering from The University of Texas at Austin in 1996.