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Welcome to the DesignCon 2020 agenda and presentation download site. Here you can view and download conference and/or Chiphead Theater presentations before, during, and after the event. If you’re looking for a presentation from a specific session that you’re unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalogue of available presentations.

Ming LiTechnical DirectorRambus

Ming Li received his B.S., M.S. and Ph.D. degrees in materials science and engineering in 1984, 1987 and 1995 respectively.  He has been a packaging engineer at Rambus since 2000.  At Rambus, Ming is responsible for IC packaging design, development and modeling, thermal and mechanical modeling of electronic packaging and systems, IC package layout, advanced IC packaging development, IC packaging assembly management and vendor relationship, and 3D IC and 2.5D silicon interposer design and process development.  Previously, he worked at Sandia National Labs as a research associate, at Tessera as a modeling engineer, and at PerkinElmer as a senior packaging engineer.