April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

William McCaffreyDigital Hardware EngineerNorthrop Grumman

Will McCaffrey is a Principal Digital Hardware Engineer at Northrop Grumman Mission Systems. He holds a BSEE from Rochester Institute of Technology in Rochester NY, and currently pursuing a MSEE at Johns Hopkins University. Since 2018 he has designed hardware interconnects for a CubeSat, designed several DDR4 implementations on high speed mixed-signal PCBs as well as designed his own high-speed mixed signal PCB. His interest is in high-speed digital design and SI/PI simulations.