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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Bachelor's and Master's degrees in Mechanical Engineering, University of California, Irvine (1987/1989) Lamination & drilling process engineer, Sigma Circuits (1991-1993) Asia Pacific Technical service and Marketing director, Nelco Products Fullerton & Singapore (1993-2006) Corporate Product Innovation Development, AVP, Wus Printed Circuit (2006-present) Eddie Mok is currently engaged in the development of advanced material and other innovative interconnect solutions for high speed digital PCBs.