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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Michael Rowlands is an SI Engineering Manager in the High-Speed Connector group at Amphenol. He specializes in signal integrity and designing 200Gbps connectors. He received a Bachelor's and Master's degree in Electrical Engineering from MIT in 1998. Upon graduation, he worked four years as a signal integrity engineer at Teradyne in Boston. He designed cable assemblies, circuit boards and interconnects for test equipment up to 6 GHz. In 2002, he worked at a startup company in Illinois. The company designed dispersion compensation microchips at 12.5 Gbps for fiber-optic communications. He designed circuit boards to demonstrate and verify 12.5Gbps performance and made algorithm improvements based on system modeling. In 2005, as part of the Research and Development at Endicott Interconnect Technologies years he designed and analyzed circuit boards, chip packages and custom computing systems. Since 2009, he's been designing next-generation 25-40Gbps I/O and board-to-board connectors. He’s also developed low-loss cable in twin-ax and co-ax structures. In 2015, he led a team developing carbon-nanotube-based electronics, which won the Molex Innovation Challenge business competition. He holds multiple patents in multi-gigahertz signal design. He has authored and presented technical papers at ECTC, DesignCon, IMAPS, IPC-APEX and PCB East; winning a DesignCon Best Paper Award in 2014 for “Quantitative EMI Analysis of Electrical Connectors Using Simulation Models.”