designcon is part of the Informa Markets Division of Informa PLC
This site is operated by a business or businesses owned by Informa PLC and all copyright resides with them. Informa PLC's registered office is 5 Howick Place, London SW1P 1WG. Registered in England and Wales. Number 8860726.
April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Madhavan Swaminathan is the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC), Georgia Tech (GT) (http://www.prc.gatech.edu). He also serves as the Site Director for the NSF Center for Advanced Electronics through Machine Learning (CAEML: https://publish.illinois.edu/advancedelectronics/) and Leads the Heterogeneous Integration area, at the SRC JUMP ASCENT Center (https://ascent.nd.edu/). Prior to joining GT, he was with IBM working on packaging for supercomputers.
He is the author of 530+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of 3 books and 5 book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is an IEEE Fellow and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society.