April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA

Welcome to the DesignCon 2022 agenda and presentation download site. Here you can view and download conference, Chiphead Theater, and other event presentations before, during, and after the event. If you're looking for a presentation from a specific session that you're unable to find here, it is likely because the presenter has not provided permission for external use or has not yet shared their presentation with us. Please check back after the event for a more complete catalog of available presentations.

Ramzi VincentSenior Principal Digital EngineerNorthrop Grumman

Ramzi Vincent is a Senior Principal Digital Engineer at Northrop Grumman Mission Systems. He is a multi-disciplinary engineer that works on projects ranging from next-generation digital and mixed signal circuit cards to next generation flip-chip and multi-chip module (MCM) package co-design efforts. Ramzi received his BEEE from the Catholic University of America and works hard to evolve the way Mission Systems performs design, simulation, and validation of the complex multi-function systems on the horizon.