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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Ramzi Vincent is a Senior Principal Digital Engineer at Northrop Grumman Mission Systems. He is a multi-disciplinary engineer that works on projects ranging from next-generation digital and mixed signal circuit cards to next generation flip-chip and multi-chip module (MCM) package co-design efforts. Ramzi received his BEEE from the Catholic University of America and works hard to evolve the way Mission Systems performs design, simulation, and validation of the complex multi-function systems on the horizon.