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April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
Tim Wig joined Intel in 2001, where he works as a signal integrity engineer in a pathfinding and spec development group whose charter includes PCIe and other interconnect standards. Tim coordinates the Card ElectroMechanical (CEM) Spec document for Gen 4.0 and 5.0, and has contributed many of the signal integrity enablers that allowed PCIe to reach 16 and 32 GT/s. His primary focus is passive component, PCB, and channel level modeling, measurement, and optimization for PCIe CEM, though he also supports the M.2, U.2, and OCuLink standards. He holds a PhD in Engineering Science from Washington State University; and an a MS and BS in Electrical Engineering and a BS in Engineering Physics from the University of North Dakota. He delivered a tutorial on PCIe Gen 4.0 to DevCon 2016.