April 5-7, 2022|Santa Clara Convention Center| Santa Clara, CA
DesignCon 2022 Schedule Builder
Location: Mission City Ballroom B1
Track: Networking Session
Format: Networking Session
Pass Type: All Access Pass
Boot Camp – AI & Deep Learning for SI/PI
Speakers: Chris Cheng (HP Enterprise), Paul D. Franzon, Ph.D., Fellow IEEE (NC State University), Osama Waqar Bhatti (Georgia Institute of Technology), YongJin Choi (Hewlett-Packard Enterprise), Madhavan Swaminathan (Georgia Institute of Technology)
Location: Ballroom GH
Track: 14. Machine Learning for Microelectronics, Signaling & System Design, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Boot Camp
Education Level: All
Pass Type: All Access Pass
Speaker: Mike Li (Intel)
Location: Ballroom EF
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
Format: Tutorial
Theme : High-speed Communications
Education Level: All
Pass Type: All Access Pass
Tutorial – PAM6 Signaling: A Potential Candidate at 224Gbps
Speakers: Geoff Zhang (AMD), Zhaoyin Daniel Wu (AMD), Jinbiao Xu (AMD), Hongtao Zhang (AMD)
Location: Ballroom AB
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design
Format: Tutorial
Theme : Data Centers
Education Level: All
Pass Type: All Access Pass
Keynote – Progress Enabled: The Convergence of Photonic & Electronic ICs
Keynote: John Bowers (University of California, Santa Barbara)
Location: Elizabeth A. Hangs Theater
Track: Keynote, 03. Integrating Photonics & Wireless in Electrical Design
Format: Keynote
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Location: Mission City Ballroom B1
Track: Networking Session
Format: Networking Session
Pass Type: All Access Pass
Tutorial – OSFP/QSFP-DD 112G PAM4 Channel for 800G System Applications
Speakers: Xu Jiang (Luxshare-Ict), Andy Nowak (Luxshare-Ict), Ivan Madrigal (AMD), Dana Bergey (Luxshare-Ict), Charles Grant (Luxshare-Ict), Geoffrey Zhang (AMD)
Location: Ballroom AB
Track: 13. Modeling & Analysis of Interconnects, 07. Optimizing High-Speed Link Design
Format: Tutorial
Theme : High-speed Communications
Education Level: All
Pass Type: All Access Pass
Tutorial – Over the Air Testing of 5G AiP Modules in High-volume Manufacturing
Speaker: Jose Moreira (Advantest)
Location: Ballroom D
Track: 03. Integrating Photonics & Wireless in Electrical Design
Format: Tutorial
Theme : 5G
Education Level: All
Pass Type: All Access Pass
Tutorial – The Real World of Power Integrity & Signal Integrity Working Together
Speakers: Heidi Barnes (Keysight Technologies), Steve Sandler (Picotest.com), Jack Carrel (AMD)
Location: Ballroom EF
Track: 10. Power Integrity in Power Distribution Networks
Format: Tutorial
Theme : Automotive, Data Centers
Education Level: All
Pass Type: All Access Pass
Panel – AMI Models & the Seven-year Itch
Moderator: Donald Telian (SiGuys)
Panelists: Walter Katz (MathWorks), Randy Wolff (Micron), Aleksey Tyshchenko (SeriaLink Systems), Michael Mirmak (Intel), Ken Willis (Cadence)
Location: Ballroom AB
Track: 02. Chip I/O & Power Modeling, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – CXL & PCIe Technologies: The Next Generation of Interconnects
Moderators: Scott Knowlton (Synopsys), Kurt Lender (Intel)
Panelists: Mohiuddin Mazumder (Intel), Ishwar Agarwal (Microsoft)
Location: Ballroom EF
Track: 05. Advanced I/O Interface Design for Memory & 2.5D/3D/SiP Integrations, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – The Case of the Closing Eyes: PAM-N, What Can be Tested?
Moderator: Chris Loberg (Tektronix)
Panelists: Cathy Liu (Broadcom), Mark Marlett (Marvell Semiconductor), Mike Li (Intel), Ransom Stephens (BitifEye Digital Test Solutions GmbH), Hiroshi Goto (Anritsu), Greg LeCheminant (Keysight Technologies), Pavel Zivny (Tektronix)
Location: Ballroom GH
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER, 12. Applying Test & Measurement Methodology
Format: Panel Discussion
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel — Bringing AI to the Edge: Hardware & Software Enables Autonomous AI Ecosystem on the Edge
Moderator: Christian Kurzke (MontaVista Linux)
Panelists: Devin Matthews (Blue River Technology), Priya Muralidharan (Infineon Technologies)
Speaker: Jim Gallagher (MontaVista Software)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Panel Discussion
Theme : Autonomous, Sensing/Vision Systems
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Location: Terra Courtyard at the Hyatt Regency
Track: Networking Session
Format: Networking Session
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Taein Shin (KAIST), Seongguk Kim (Korea Advanced Institute of Science and Technology), Joungho Kim (KAIST)
Authors: Hyunwook Park (KAIST), Keunwoo Kim (KAIST), Keeyoung Son (KAIST)
Location: Ballroom D
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Consumer Electronics, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speakers: Joungho Kim (KAIST), Seongguk Kim (Korea Advanced Institute of Science and Technology)
Authors: Hyunwook Park (Korea Advanced Institute of Science and Technology), Taein Shin (Korea Advanced Institute of Science and Technology), Daehwan Lho (Korea Advanced Institute of Science and Technology), Keeyoung Son (Korea Advanced Institute of Science and Technology), Keunwoo Kim (Korea Advanced Institute of Science and Technology), Minsu Kim (Korea Advanced Institute of Science and Technology), Joonsang Park (Korea Advanced Institute of Science and Technology)
Location: Ballroom G
Track: 05. Advanced I/O Interface Design for Memory & 2.5D/3D/SiP Integrations, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
A Step-by-step Guide to a Novel Lab Correlated PDN Co-simulation Methodology
Speakers: Idan Ben Ezra (Broadcom Semiconductors), John Phillips (Cadence Design Systems Inc.), Ilan Wolff (Arista Networks)
Location: Ballroom F
Track: 10. Power Integrity in Power Distribution Networks, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Challenges & Solutions in Physical Layer Testing for Automotive Wired Communications
Speakers: Julien Henaut (BitifEye Digital Test Solutions GmbH), Kevin Kershner (Keysight Technologies)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Future Data Centers and the Evolution of Memory Systems
Speaker: Steven Woo (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Ching-Chao Huang (AtaiTec)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Onchip ESD Protection Structure Modeling Methodology
Speaker: Zhekun Peng (EMC Laboratory, Missouri S&T)
Author: DongHyun Kim (EMC laboratory, Missouri S&T)
Location: Ballroom E
Track: 11. Electromagnetic Compatibility & Interference
Format: Technical Session
Theme : Security
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Speakers: Christopher DiMinico (MC Communications/PHY-SI LLC/SenTekse), Michael Klempa (Amphenol ICC), David Nozadze (Cisco Systems), Michael Rowlands (Amphenol HSC)
Authors: Mike Resso (Keysight Technologies), Curtis Donahue (Rohde & Schwarz), Oj Danzy (Keysight Technologies), Richard Mellitz (Samtec), Mike Sapozhnikov (Cisco Systems), Amendra Koul (Cisco Systems), Adee Ran (Cisco Systems), Upen Reddy Kareti (Cisco Systems)
Location: Ballroom H
Track: 13. Modeling & Analysis of Interconnects, 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : High-speed Communications
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Accurate Correlation Between SI Simulation & Measurement in High-speed Backplane Connector Designs
Speakers: Leon Wu (Samtec), Mick Zhou (Samtec)
Location: Ballroom G
Track: 13. Modeling & Analysis of Interconnects, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
DDR4-3200 FPGA-based System with Interposer Power Aware SI Simulation to Measurement Correlation
Speakers: Benjamin Dannan (Northrop Grumman), Randy White (Keysight Technologies)
Authors: Hermann Ruckerbauer (Eye Know How), HeeSoo Lee (Keysight Technologies)
Location: Ballroom E
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Developing High-Quality Test Fixtures for De-embedding of S-Parameters
Speaker: James Drewniak (Clear Signal Solutions, Inc.)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
GDDR6 Memory Enables High-Performance Inferencing
Speaker: Frank Ferro (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Generalized ccICN (Component Contribution Integrated Crosstalk Noise)
Speaker: Se-Jung Moon (Intel)
Authors: Mohiuddin Mazumder (Intel), Zuoguo Wu (Intel), Karsten Stangel (Intel), Umair Khan (Intel), Masashi Shimanouchi (Intel)
Location: Ballroom H
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Infrastructure
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Integration-based Method for Surface Roughness Modeling for Copper Foils
Speakers: Yuanzhuo Liu (Missouri University S&T), DongHyun Kim (Missouri S&T)
Authors: Yuandong Guo (EMC Laboratory, Missouri University of Science and Technology), Chaofeng Li (Missouri University S&T), Xiaoning Ye (Intel)
Location: Ballroom D
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Multi-Sensor Safety Calibration for ADAS Applications
Speaker: Mohammad Musa (Deepen AI)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, Autonomous
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: Kyle Chen (Microsoft)
Authors: Suomin Cui (Cadence Design Systems), Grace Yu (Microsoft), Jian Lui (Cadence Design System)
Location: Ballroom F
Track: 07. Optimizing High-Speed Link Design, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Keynote – The Realities of AI & Machine Learning: Cut Through the Hype & Move to Production
Keynote: Laurence Moroney (Google)
Location: Elizabeth A. Hangs Theater
Track: Keynote, 14. Machine Learning for Microelectronics, Signaling & System Design
Format: Keynote
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Josh Builta (Omdia)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Test compliance automation solution for high-speed Ethernet interconnects using ZNrun
Speaker: Curtis Donahue (Rohde & Schwarz)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Towards Open-source Edge-cloud Collaboration Architecture
Speaker: Dylan Kennedy (EMQ)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Accelerating Data Interconnects with PCI Expressâ„¢ 6.0 & 5.0 Interface IP
Speaker: Arjun Bangre (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Benjamin Dannan (Northrop Grumman), James Kuszewski (Northrop Grumman), Ramzi Vincent (Northrop Grumman), William McCaffrey (Northrop Grumman), Albert Park (Northrop Grumman)
Author: Shin Wu (Northrop Grumman)
Location: Ballroom F
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging, 02. Chip I/O & Power Modeling
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Improving AR/VR Reality with 3D Time of Flight Sensing
Speaker: Rolf Weber (Infineon Technology)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Theme : Consumer Electronics, Sensing/Vision Systems
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Joonsang Park (Korea Advanced Institute of Science and Technology, KAIST), Joungho Kim (KAIST)
Authors: Minsu Kim (Korea Advanced Institute of Science and Technology, KAIST), Seonguk Choi (Korea Advanced Institute of Science and Technology, KAIST), Jihun Kim (Korea Advanced Institute of Science and Technology, KAIST), Haeyoen Kim (Korea Advanced Institute of Science and Technology, KAIST), Hyunwook Park (Korea Advanced Institute of Science and Technology, KAIST), Seongguk Kim (Korea Advanced Institute of Science and Technology, KAIST), Taein Shin (Korea Advanced Institute of Science and Technology, KAIST)
Location: Ballroom E
Track: 14. Machine Learning for Microelectronics, Signaling & System Design, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Autonomous, Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Long-haul Inter-domain Power Noise
Speakers: Ethan Koether (Project Kuiper - Amazon), Istvan Novak (Samtec), Mario Rotigni (STMicroelectronics)
Authors: Kristoffer Skytte (Cadence), Joseph Hartman (Oracle Corporation), Shirin Farrahi (Cadence), Sammy Hindi (Ampere Computing), John Phillips (Cadence)
Location: Ballroom H
Track: 10. Power Integrity in Power Distribution Networks, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Making Transit Modernization Accessible: Lessons Learned
Speakers: Nirit Glazer, Ph.D. (LookingBus), Yariv Glazer (LookingBus)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Autonomous, Infrastructure
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Performance Assessment of W-band Antennas on Low-loss Inhomogeneous PCB Substrates
Speaker: Chudy Nwachukwu (ITEQ)
Authors: Maria Serrano-Serrano (INAOE), Edgar ColÃn-Beltrán (Conacyt-INAOE), Reydezel Torres-Torres (INAOE)
Location: Ballroom D
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : 5G, High-speed Communications
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass
Receiver Calibration & Testing Methodologies Comparison for PAM-4 IOs
Speaker: Marianne Nourzad (Intel)
Authors: Hsinho Wu (Intel), Christiaan Bil (Intel), Joseph Boon Hock (Intel), Masachi Shimanouchi (Intel), Karsten Stangel (Intel), Jong-Ru Guo (Intel), Mohiuddin Mazumder (Intel), Zuoguo Wu (Intel), Mike Li (Intel)
Location: Ballroom G
Track: 12. Applying Test & Measurement Methodology, 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
USB Type-C® Standard PHY testing
Speaker: Mike Engbretson (Teledyne LeCroy)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
App Startup Compiler Optimizations & Techniques for Embedded Systems
Speaker: Aditya Kumar (Snapchat)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Power integrity measurement fundamentals
Speaker: Jeff Cuyle (Rohde & Schwarz)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
The Great Chip Shortage - ways to manage supply issues in IoT.
Speaker: Michael Wilkinson (Paragon Innovations)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Yuandong Guo (EMC Laboratory, Missouri University of Science and Technology)
Author: DongHyun Kim (EMC Laboratory, Missouri University of Science and Technology)
Location: Ballroom G
Track: 13. Modeling & Analysis of Interconnects, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass
Challenges of Automated Stressed Receiver Tolerance Testing: NRZ, PAM4 & Beyond
Speakers: Wolfgang Köbele (BitifEye R&D GmbH), Anton M. Unakafov (BitifEye Digital Test Solutions GmbH), Ransom Stephens (BitifEye Digital Test Solutions GmbH), Parthasarathy Raju (BitifEye Research & Development)
Authors: Bernhard Leibold (BitifEye R&D GmbH), Hermann Stehling (BitifEye Digital Test Solutions GmbH), Valentina Unakafova (BitifEye Digital Test Solutions GmbH)
Location: Ballroom F
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER, 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: Edo Cohen (Valens)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, Sensing/Vision Systems
Pass Type: 2-Day Pass, All Access Pass
In Search of the Holy Grail: Laminate Dk & Df Values that You Can Trust
Speaker: Bill Hargin (Z-zero)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Memory Bandwidth for AI/ML Races Higher with HBM3
Speaker: Frank Ferro (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Next Generation 224Gbps-PAM4 SERDES, Channel & Link Systems
Speaker: Mike Li (Intel)
Authors: Hsinho Wu (Intel), Masashi Shimanouchi (Intel), Jenny Jiang (Intel), Zhiguo Qian (Intel), Ajay Balankutty, Itamar Levin, Ariel Cohen, Stas Litski
Location: Ballroom H
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Noise Coupling Path Visualization for Complex Electronic Systems
Speaker: Seungtaek Jeong (Missouri S&T)
Authors: Hwanwoo Shim (Samsung Electronics), Seyoon Cheon (Samsung Electronics), Myeonghwan Kim (Samsung Electronics), Chulsoon Hwang (Missouri S&T)
Location: Ballroom E
Track: 11. Electromagnetic Compatibility & Interference, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Consumer Electronics, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: John James (Anritsu)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Aleksey Tyshchenko (SeriaLink Systems)
Authors: David Halupka (SeriaLink Systems), Venu Balasubramonian (Marvell Semiconductor), Lenin Patra (Marvell Semiconductor)
Location: Ballroom D
Track: 02. Chip I/O & Power Modeling, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Location: Expo Floor
Track: Networking Session
Format: Networking Session
Pass Type: 2-Day Pass, All Access Pass
Panel: Embracing the Future of Embedded Systems and Devices with IoT
Speakers: James Odeyinka (Walgreens), Jonathan Cassell (Omdia), Kevin Lockwood (MistyWest)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Limits of High-speed Connector & Cable Technology
Speaker: Mick Felton (ACES)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Overpass – the roadmap to 56G, 112G and 224G IO interconnect solutions
Speaker: Vishal Chandrasekar (Amphenol)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Sponsored Workshop Session: Towards IoT Devices Integration in Smart Homes
Speaker: Alessandro Bassano (Technology and Innovation Institute)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
A comparison of solutions for jitter and noise separation
Speaker: Mike Schnecker (Rohde & Schwarz)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
EMI Qualification of QSFP & OSFP Electrical/optical Modules
Speaker: Philippe Sochoux (Juniper Networks)
Authors: David Pommerenke (Graz University of Technology), Federico Centola (Google), Tamar Makharashvili (Google), DongHyun Kim (Missouri S&T), Bertwin Novak (TU Graz), Franz Gabalier (Graz University of Technology), Xu Wang (Missouri S&T), Xiao Li (Cisco), Sameer Walunj (Juniper Networks), Kaustav Ghosh (Juniper Networks)
Location: Ballroom E
Track: 11. Electromagnetic Compatibility & Interference, 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speakers: Zhaoyin Daniel Wu (AMD), Hongtao Zhang (AMD), Chuan Xie (AMD), Mayank Raj (AMD), Parag Upadhyaya (AMD), Yohan Frans (AMD), Geoff Zhang (AMD)
Location: Ballroom G
Track: 03. Integrating Photonics & Wireless in Electrical Design, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Implementing CXLâ„¢ 2.0 Interconnect Solutions
Speaker: Arjun Bangre (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
PCB Manufacturing Design Guidelines for Cost Reduction in Immersion Cooling
Speaker: Eddie Mok (Wus Printed Circuit)
Authors: Dan Liu (Alibaba), Yangfan Zhong (Alibaba), Xianfeng Chen (Alibaba), Xiaopeng Li (Alibaba), David Wei (Wus Printed Circuit)
Location: Ballroom D
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Data Centers, Infrastructure
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
PCI Express Technology: Evolving Automotive Connectivity for the Next Generation of Vehicles
Speaker: William Chen (Cadence)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Security Integrity Analytics by Thermal Side-channel Simulation: An ML-augmented Auto-POI Approach
Speakers: Jimin Wen (Ansys), Norman Chang (Ansys), Lang Lin (Ansys), David Luo (National Taiwan University), Jyh-Shing Roger Jang (National Taiwan University), Hua Chen (Ansys)
Location: Ballroom H
Track: 14. Machine Learning for Microelectronics, Signaling & System Design, 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Theme : Automotive, Security
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Time Domain Reflectometer Application for Vector Network Analyzers
Speaker: Michael Yang (Anritsu)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
VNA Calibration Essentials for Practicing Engineers
Speaker: Julian Lechner (Samtec)
Authors: Travis S Ellis (Samtec), Jason Sia (Samtec), Pete Pupalaikis (Nubis), Gustavo Blando (Samtec), Istvan Novak (Samtec)
Location: Ballroom F
Track: 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : High-speed Communications
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
New System-level Opportunities with OSFP-XD
Speaker: Brian Kirk (Amphenol)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Automotive High-Speed Signal Protocols & Standards
Speaker: Harsh Patel (Amphenol)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Lessons learned from building a connected artificial nose using TinyML
Speaker: Benjamin Cabé (Microsoft)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Kinger Cai (Intel)
Authors: Jayanth Kalyan (Intel), Vishram Pandit (Intel), Ashwini Anil Kumar (Intel), Andrea Astua Moya (Intel)
Location: Ballroom D
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging, 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Building Safe & Secure Systems Using Open Source
Speakers: Corey Minyard (MontaVista Linux), Christian Kurzke (MontaVista Linux)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, Security
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
PAM4 BER and JTOL Test Solution for PCIe® 6.0 and Beyond
Speaker: Hiroshi Goto (Anritsu)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Practical signal integrity measurements on embedded serial interfaces
Speaker: Mike Schnecker (Rohde & Schwarz)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Proper Ground Return Via Placement for 40+ Gbps Signaling
Speakers: Donald Telian (SiGuys), Michael Steinberger (MathWorks)
Authors: Michael Tsuk (MathWorks), Vishwanath Iyer (MathWorks), Janakinadh Yanamadala (MathWorks)
Location: Ballroom F
Track: 07. Optimizing High-Speed Link Design, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Securing Automotive Semiconductors in the New Centralized Car Architecture
Speaker: Thierry Kouthon (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Three Very Low-cost Technology Solutions for SI Applications
Speaker: Eric Bogatin (University of Colorado, Boulder)
Authors: Melinda Piket-May (CU), Aditya Rao (CU), Julio Puentes (CU)
Location: Ballroom H
Track: 12. Applying Test & Measurement Methodology, 04. Advances in Materials & Processing for PCBs, Modules & Packages
Format: Technical Session
Theme : High-speed Communications
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Validation Shift-left: Enabling Early SerDes Mixed-signal Validation
Speakers: David Halupka (SeriaLink Systems), Aleksey Tyshchenko (SeriaLink Systems), Richard Allred (MathWorks, Inc.)
Authors: Marc Erickson (MathWorks, Inc.), Tripp Worrell (MathWorks, Inc.), Barry Katz (MathWorks, Inc. / SiSoft), Jesson John (MathWorks, Inc.), Ranjan Sahoo (NXP Semiconductors), Lenin Patra (Marvell Semiconductor), Venu Balasubramonian (Marvell Semiconductor), Pragati Tiwary (MathWorks, Inc.)
Location: Ballroom G
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Augmented-Reality Optical Narrowcasting (ARON)
Speaker: Narkis Shatz (SureFire)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Bespoke Silicon: How Systems Companies are Driving Chip Design
Panelist: Rob Aitken (Arm Research)
Speaker: John Lee (Ansys)
Location: Chiphead Theater
Track: Chiphead Theater, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Chiphead Theater
Theme : Automotive, Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
How to Select the Best RTOS for your Connected Device
Speaker: Jonathan Beri (Zephyr Project)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
2.5D/3D Architecture Solutions
Speaker: Ming Li (Rambus)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Automotive Ethernet MGBase-T Compliance testing
Speaker: Mike Schnecker (Rohde & Schwarz)
Location: Great America Meeting Room 2
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Live Demo of PAM4 BERT and JTOL, FEC and Burst Error Analysis
Speaker: Robert Luo (Anritsu)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – AI & Digital Twins for SI/PI Analysis & Design
Moderator: Chris Cheng (HP Enterprise)
Panelists: Paul D. Franzon, Ph.D., Fellow IEEE (NC State University), Norman Chang (Ansys), Osama Waqar Bhatti (Georgia Institute of Technology), Todd Westerhoff (Siemens)
Location: Ballroom G
Track: 14. Machine Learning for Microelectronics, Signaling & System Design, 02. Chip I/O & Power Modeling
Format: Panel Discussion
Theme : Infrastructure, Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – Implementing a Digital Transformation Framework for Automotive Applications
Moderator: Jean-Marie Brunet (Siemens EDA)
Panelists: Arun Mulpur (MathWorks), Veerbhan Kheterpal (Quadric.oi), Soshun Arai (TIER IV), Hieu Tran (Viosoft), Axel Fuchs, P.h.D (Lumotive)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Panel Discussion
Theme : 5G, Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Moderator: Heidi Barnes (Keysight Technologies)
Panelists: Istvan Novak (Samtec), Eric Bogatin (University of Colorado, Boulder), Steve Sandler (Picotest.com), Jim DeLap (ANSYS), Joe Hock (Kyocera - AVX)
Location: Ballroom H
Track: 10. Power Integrity in Power Distribution Networks, 12. Applying Test & Measurement Methodology
Format: Panel Discussion
Theme : Automotive, Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – OIF Electrical I/O Specifications: Progress on CEI 112Gbps & 224Gbps
Moderator: Nathan Tracy (TE Connectivity)
Panelists: Cathy Liu (Broadcom Inc.), John Calvin (Keysight Technologies), Mike Li (Intel), Jeffery Maki (Juniper Networks)
Location: Ballroom D
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Production ML for Mission-Critical Applications
Speaker: Robert Crowe (Google)
Location: Chiphead Theater
Track: Chiphead Theater, 14. Machine Learning for Microelectronics, Signaling & System Design
Format: Chiphead Theater
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Location: Expo Floor
Track: Networking Session
Format: Networking Session
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
112G-PAM4-QSFP Interconnect: A Study in Air Cooling & Immersion Cooling
Speakers: Andy Nowak (Luxshare-ICT), Xu Jiang (Luxshare-ICT)
Authors: Dan Liu (Alibaba), Liang Chen (Alibaba), Yangfan Zhong (Alibaba), Huanhuan Shen (Luxshare-ICT), Melvin Li (Luxshare-ICT)
Location: Ballroom F
Track: 07. Optimizing High-Speed Link Design, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Advanced Testing Challenges at 32GBaud PAM4 with PCIe 6.0
Speakers: Rick Eads (Keysight Technologies), Pegah Alavi (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Equalizer (Tx/Rx) Optimization at 112Gbps
Speakers: Kalev Sepp (Sepson Analytics), Ryan Chodora (Keysight Technologies)
Authors: John Calvin (Keysight Technologies), Varun Garg (Keysight Technologies)
Location: Ballroom H
Track: 12. Applying Test & Measurement Methodology, 09. High-Speed Signal Processing, Equalization & Coding/FEC
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Imitate Expert Policy & Learn Beyond: A Practical PDN Optimizer by Imitation Learning
Speakers: Haeyoen Rachel Kim (KAIST), Jihun Kim (Korea Advanced Institute of Science and Technology, KAIST), Joonsang Park (Korea Advanced Institute of Science and Technology), Keeyoung Son (Korea Advanced Institute of Science and Technology)
Authors: Minsu Kim (KAIST), Subin Kim (Samsung Global Technology Center (GTC)), Hyunwook Park (KAIST), Joungho Kim (KAIST), Seonguk Choi (Korea Advanced Institute of Science and Technology, KAIST)
Location: Ballroom D
Track: 14. Machine Learning for Microelectronics, Signaling & System Design, 10. Power Integrity in Power Distribution Networks
Format: Technical Session
Theme : Autonomous, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: Jihun Kim (Korea Advanced Institute of Science and Technology)
Authors: Minsu Kim (Korea Advanced Institute of Science and Technology), Joungho Kim (Korea Advanced Institute of Science and Technology), Hyunwook Park (Korea Advanced Institute of Science and Technology), Jiwon Yoon (Korea Advanced Institute of Science and Technology), Seonguk Choi (Korea Advanced Institute of Science and Technology, KAIST), Joonsang Park (Korea Advanced Institute of Science and Technology), Haeyoen Rachel Kim (KAIST), Keeyoung Son (Korea Advanced Institute of Science and Technology), Seongguk Kim (Korea Advanced Institute of Science and Technology), Daehwan Lho (Korea Advanced Institute of Science and Technology), Keunwoo Kim (Korea Advanced Institute of Science and Technology), Jinwook Song (Samsung Electronics), Kyunguk Kim (Samsung Electronics), Jonggyu Park (Samsung Electronics)
Location: Ballroom G
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Open Standard Acceleration APIs for Safety-Critical Graphics, Vision & Compute
Speaker: Neil Trevett (The Khronos Group)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, Sensing/Vision Systems
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Optimizing for Supply Chain Challenges: A Scalable Approach for the Complete Product Family
Speaker: Harrison Donahue (The QT Company)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
PCB Stackup & Launch Optimization in High-speed PCB Designs
Speaker: Shawn Tucker (Samtec)
Authors: Travis Ellis (Samtec), Shawn Tucker (Samtec)
Location: Ballroom E
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 07. Optimizing High-Speed Link Design
Format: Technical Session
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass
Next Gen Development in Type-C Ecosystem
Speakers: Jit Lim (Keysight Technologies), Pedro Merlo (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Enhancing Safety & Performance in ADAS/AV with a Motion First Approach to Perception
Speaker: Joel Pazhayampallil (BlueSpace.ai)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Autonomous, Sensing/Vision Systems
Pass Type: 2-Day Pass, All Access Pass
How to Optimize TxFFE & What We Can Learn From the Optimization
Speaker: Ransom Stephens (BitifEye Digital Test Solutions GmbH)
Authors: Anton M. Unakafov (BitifEye Digital Test Solutions GmbH), Sergio Cinà (BitifEye Digital Test Solutions GmbH), Wolfgang Kobele (BitifEye Digital Test Solutions GmbH), Hermann Stehling (BitifEye Digital Test Solutions GmbH)
Location: Ballroom E
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Magnetic Near-field Evaluation Methodology for Integrated Circuit In-package Coupling Assessment
Speakers: Maryna Nesterova (Aprel Inc), Stuart Nicol (Aprel Inc)
Author: Yuliya Nesterova (Carleton Univeristy)
Location: Ballroom D
Track: 11. Electromagnetic Compatibility & Interference, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
New Power Integrity Methodology & Mitigation Effect of PDN Voltage Decay
Speaker: Iliya Zamek (ZI_Consulting)
Location: Ballroom G
Track: 10. Power Integrity in Power Distribution Networks, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: Sherry Hess (Cadence)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Physical Layer Characterization of PCI Express 6.0 PAM4 SerDes Designs
Speaker: David Bouse (Tektronix)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Understanding the Effect of Temperature on Permittivity & Loss of Dielectric Substrates
Speaker: Allen F. Horn III (Rogers Corporation)
Author: Christopher J. caisse (Rogers Corporation)
Location: Ballroom H
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages
Format: Technical Session
Theme : Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Keynote – Space Tech: Present & Future
Keynote: José Morey (NASA, IBM, Hyperloop Transportation, Liberty BioSecurity Health and Technology)
Location: Elizabeth A. Hangs Theater
Track: Keynote
Format: Keynote
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Chairperson's Opening - Semiconductor Update
Speaker: Jon Ellis (Omdia)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Overview and Challenges of Running D2D over Interposers
Speaker: Ken Willis (Cadence)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Quick Guide to Recalibrate Your Signal Integrity Intuition for PCI Express Applications
Speakers: Mike Resso (Keysight Technologies), Saish Sawant (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
COM-based IBIS-AMI for 106/112Gbps System Compliance
Speaker: Vijay Kasturi (Intel)
Author: Hsinho Wu (Intel)
Location: Ballroom D
Track: 02. Chip I/O & Power Modeling
Format: Technical Session
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass
Speaker: Minsu Kim (KAIST)
Authors: Keeyoung Son (KAIST), Jihun Kim (KAIST), Joonsang Park (KAIST), Seonguk Choi (KAIST), Haeyoen Kim (KAIST), Joungho Kim (KAIST), Subin Kim (Samsung Global Technology Center (GTC)), Hyunwook Park (Korea Advanced Institute of Science and Technology)
Location: Ballroom E
Track: 14. Machine Learning for Microelectronics, Signaling & System Design
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Five Tips for Power Integrity Measurements on a Budget
Speaker: Eric Bogatin (University of Colorado, Boulder)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Moving Towards High Resolution Automotive Radar Systems
Speaker: Vahid Bonehi (Infineon)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, Sensing/Vision Systems
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
PCIe 6.0 & Beyond: PAM4 Burst BER & Jitter Tolerance Test with FEC Uncorrectable Error Analysis
Speaker: Hiroshi Goto (Anritsu)
Location: Great America Meeting Room 1
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Practical Methods of Estimating Dynamic Current for Calculating PDN Target Z
Speakers: Heidi Barnes (Keysight Technologies), Steve Sandler (Picotest.com)
Author: Jack Carrel (AMD)
Location: Ballroom H
Track: 10. Power Integrity in Power Distribution Networks, 02. Chip I/O & Power Modeling
Format: Technical Session
Theme : Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Speaker: Keeyoung Son (Korea Advanced Institute of Science and Technology)
Authors: Joungho Kim (Korea Advanced Institute of Science and Technology), Keunwoo Kim (Korea Advanced Institute of Science and Technology), Minsu Kim (Korea Advanced Institute of Science and Technology), Taein Shin (Korea Advanced Institute of Science and Technology), Hyunwook Park (Korea Advanced Institute of Science and Technology), Seongguk Kim (Korea Advanced Institute of Science and Technology), Seonguk Choi (Korea Advanced Institute of Science and Technology, KAIST), Joonsang Park (Korea Advanced Institute of Science and Technology), Jihun Kim (Korea Advanced Institute of Science and Technology, KAIST), Haeyoen Rachel Kim (KAIST)
Location: Ballroom F
Track: 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Transmitter Jitter Measurement Methodologies for PAM-4 IOs
Speaker: Marianne Nourzad (Intel)
Authors: Hsinho Wu (Intel), Jong-Ru Guo (Intel), Zuoguo (Joe) Wu (Intel), John Yang (Intel), Masachi Shimanouchi (Intel), Mohiuddin Mazumder (Intel), Mike Li (Intel)
Location: Ballroom G
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER, 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Smoke and Mirrors: communication in the IoT world
Speaker: Robert Hafernik (Siemens)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Solving Your Forward Error Correction Problems
Speaker: Mike Beyers (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
It's just a Vulnerable Computer: Protecting Autonomous Systems
Speaker: Julia Downes (Defence Science and Technology Laboratory (DSTL))
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT), Security
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Addressing 112G Connector+PCB Modeling Without Having to Simulate with Terabyte Servers
Speakers: Davi Correia (Cadence), Michael Rowlands (Amphenol HSC)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
A Study on 224G Channel Characteristics
Speaker: Zach Peng (TE Connectivity)
Authors: Xiaoxuan Liu (ZTE), Changgang Yin (ZTE), Zhongmin Wei (ZTE), Feng Wu (Sanechips/ZTE), Ming Zheng (ZTE)
Location: Chiphead Theater
Track: Chiphead Theater, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Lightning Talk
Theme : High-speed Communications
Education Level: Advanced
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Automotive Semis Shifts into Overdrive
Speaker: Sang Oh (Omdia)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Electro-optic & Custom Photonic Co-design in Monolithic Silicon Photonics Technology
Speaker: Jignesh Patel (GlobalFoundries)
Authors: Jigesh K. Patel (Synopsys), Enrico Ghillino (Synopsys), Pablo Mena (Synopsys), Khaled Nikro (Synopsys), Dan Herrmann (Synopsys), Robert Scarmozzino (Synopsys), Rino Sunarto (Synopsys), Twan Korthorst (Synopsys), Dwight Richards (College of Staten Island - CUNY), Greg O’Malley (GlobalFoundries), Frederick G Anderson (GlobalFoundries)
Location: Ballroom E
Track: 03. Integrating Photonics & Wireless in Electrical Design, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Investigation of Low-etch or Non-oxide Surface Treatment on Stripline Insertion Loss
Speakers: Xiaoning Ye (Intel), Subas Bastola (Intel)
Authors: Amy Luoh (Intel), Vijay Kunda (Intel), Gary Brist (Intel), Aravind Munukutla (Intel)
Location: Ballroom G
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : Data Centers
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Reflecting on Reflections: An Evaluation of New & Standardized Metrics
Speakers: Steve Krooswyk (Samtec), Beomtaek Lee (Intel)
Authors: Hansel Dsilva (Achronix Semiconductor), Richard Mellitz (Samtec), Adam Gregory (Samtec), Stephen Hall (Intel)
Location: Ballroom D
Track: 07. Optimizing High-Speed Link Design, 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
System Co-design for Sleek Detachable/tablet Reference Design
Speaker: Kinger Cai (Intel)
Authors: Aiswarya Pious (Intel), Vishram Pandit (Intel), Tarakesava Reddy (Intel), Piyush Bhatt (Intel), Samantha Rao (Intel), Yagnesh Waghela (Intel)
Location: Ballroom F
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Consumer Electronics
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Transient vs. Statistical: A Comparative Study on Practical Parallel Link Qualification Techniques
Speaker: Ashkan Hashemi (Amazon)
Location: Ballroom H
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Consumer Electronics, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
De-embedding Method for 224G High Bandwidth
Speakers: Jinlong Li (ZTE), Rong Liu (ANSYS)
Authors: Zhongmin Wei (ZTE), Bi Yi (ZTE), Yu Bi (ZTE)
Location: Chiphead Theater
Track: Chiphead Theater, 12. Applying Test & Measurement Methodology
Format: Lightning Talk
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Symmetrical Multi-Processing (SMP) with FreeRTOS and Raspberry Pi Pico
Speaker: Dan Gross (AWS)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Location: Expo Floor
Track: Networking Session
Format: Networking Session
Pass Type: 2-Day Pass, All Access Pass
Optimal PDN Design Method for Mobile Phone Based on Q-learning Algorithm with Dynamic PI Simulation
Speaker: Jaeyoung Shin (Samsung Electronics)
Location: Chiphead Theater
Track: Chiphead Theater, 10. Power Integrity in Power Distribution Networks
Format: Lightning Talk
Theme : Consumer Electronics
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Equipment Teardown Session by Omdia
Speaker: Jon Ellis (Omdia)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Ken Willis (Cadence), Xin Chang (Meta)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
224Gbps-PAM4 End-to-end Channel Solutions for High-density Networking System
Speaker: Jenny Jiang (Intel)
Authors: Mike Li (Intel), Ed Milligan (Intel), John Medina (Intel), Qian Ding (Intel), Kemal Aygun (Intel), Hsinho Wu (Intel), Masashi Shimanouchi (Intel)
Location: Ballroom H
Track: 07. Optimizing High-Speed Link Design, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Applications of High Bandwidth AWGs in Receiver Testing: Tricks of the Trade
Speaker: Julien Henaut (BitifEye Digital Test Solutions GmbH)
Authors: Anton M. Unakafov (BitifEye Digital Test Solutions GmbH), Ransom Stephens (BitifEye Digital Test Solutions GmbH), Nithin Parameshwaraiah (BitifEye Digital Test Solutions GmbH), Afshin Attarzadeh (BitifEye Digital Test Solutions GmbH), Valentina Unakafova (BitifEye Digital Test Solutions GmbH)
Location: Ballroom E
Track: 12. Applying Test & Measurement Methodology, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: Introductory
Pass Type: 2-Day Pass, All Access Pass
Speaker: Masashi Shimanouchi (Intel)
Authors: Mike Li (Intel), Hsinho Wu (Intel)
Location: Ballroom D
Track: 08. Measurement & Simulation Techniques for Analyzing Jitter, Noise & BER
Format: Technical Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Effective Intra-pair Skew, EIPS & Intra-pair Skew Modeling Method
Speaker: Se-Jung Moon (Intel)
Authors: Beomtaek Lee (Intel), Xinjun Zhang (Intel), Jianting Li (Intel), Jong-Ru Guo (Intel)
Location: Ballroom G
Track: 13. Modeling & Analysis of Interconnects, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Theme : Infrastructure
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Mainstream Signal Integrity Workflow for PCIe 6.0 PAM4 Signaling
Speakers: Jared James (Cadence), Tony Chen (Cadence)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Pavel Zivny (Tektronix), Maria Agoston (Tektronix)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, High-speed Communications
Pass Type: 2-Day Pass, All Access Pass
Novel Power-integrity Solutions for Multi-HSIO with Silicon Co-relation
Speakers: Mukesh Moorthy (Intel), Manjunath J (Intel)
Location: Ballroom F
Track: 10. Power Integrity in Power Distribution Networks, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Physical Layer Validation Challenges of Characterizing 100/200 Gbps/lane Designs
Speaker: John Calvin (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
The Next Tipping Point for Semiconductors
Speaker: Michael Yang (Omdia)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Modern Threats and Modern Mitigations for Device Security
Speaker: Window Snyder (Thistle Technologies)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
How To Efficiently Build and Analyze Memory Bus to Meet DDR Specification
Speakers: HeeSoo Lee (Keysight Technologies), Shaishav Pandya (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
A T-coil Enhanced 18Gbps Memory Interface with Tx Bandwidth Extension & Rx Training Technique
Speaker: Billy Koo (Samsung Electronics)
Location: Ballroom E
Track: 05. Advanced I/O Interface Design for Memory & 2.5D/3D/SiP Integrations, 06. System Co-Design: Modeling, Simulation & Measurement Validation
Format: Technical Session
Theme : Autonomous
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Experiment & Simulation Studies on Resonances due to Period Structure in PCBs
Speaker: Sean Shi (Shennan Circuits)
Authors: Kai Li (Shennan Circuits), Yifeng Li (Shennan Circuits), Wei He (Xpeedic Technology), Xuechuan Han (Shennan Circuits), Dazhou Ding (Shennan Circuits), Zhouxiang Su (Xpeedic Technology)
Location: Ballroom D
Track: 04. Advances in Materials & Processing for PCBs, Modules & Packages, 13. Modeling & Analysis of Interconnects
Format: Technical Session
Theme : Data Centers, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Exploring the Requirements for 224Gbps Channel Characterization Using Simulations & Measurements
Speakers: Rick Rabinovich (Keysight Technologies), Mike Resso (Keysight Technologies)
Authors: Luis Boluña (Keysight Technologies), John Calvin (Keysight Technologies), Francesco de Paulis (University of L'Aquila), Richard Mellitz (Samtec)
Location: Ballroom F
Track: 07. Optimizing High-Speed Link Design, 12. Applying Test & Measurement Methodology
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
IBIS-AMI Modeling & Correlation Methodology for ADC-Based SerDes Beyond 100Gbps
Speakers: Aleksey Tyshchenko (SeriaLink Systems), Richard Allred (MathWorks), Clinton Walker (Alphawave IP)
Authors: David Halupka (SeriaLink Systems), Tripp Worrell (MathWorks), Barry Katz (MathWorks / SiSoft), Adrien Auge (Alphawave IP)
Location: Ballroom G
Track: 02. Chip I/O & Power Modeling, 07. Optimizing High-Speed Link Design
Format: Technical Session
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Optimization of a Co-packaged Laser Module Design Using Statistical Analysis for Signal Integrity
Speaker: Junho Lee (Microsoft)
Location: Ballroom H
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Technical Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
Role of Open Standards for the Long-term Sustainability of Networking Technologies
Speaker: Dr. Kirsten Matheus (BMW Group)
Location: Ballroom C
Track: Drive World - Advanced Automotive
Format: Technical Session
Theme : Automotive, High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass
The Future of 224G Serial Links
Speaker: Wendy Wu (Cadence)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Stephen Olsen (Blackberry)
Location: Ballroom B
Track: Embedded IoT World
Format: Embedded IoT World Session
Theme : Internet of Things (IoT)
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – AI/Robotics Startups That Support Manufacturing
Moderator: George Chao (Manex Consulting)
Panelists: Huang Lee (Taiwania Capital), Dr. Michael Benedict (RIOS), Quinn Killough (Landing AI)
Location: Chiphead Theater
Track: Chiphead Theater
Format: Chiphead Theater
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Power Integrity Simulation and Measurement Tips and Tricks
Speakers: Heidi Barnes (Keysight Technologies), Don Schoenecker (Keysight Technologies)
Location: Mission City Ballroom B4
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speakers: Suomin Cui (Cadence Design Systems), Kyle Chen (Microsoft)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – PCIe6.0: Ingredients for Success
Moderator: Pegah Alavi (Keysight Technologies)
Panelists: Tim Wig (Intel), Steve Krooswyk (Samtec), Rick Eads (Keysight Technologies), David Bouse (Tektronix), Madhumita Sanyal (Synopsys), Ying Li (NVIDIA), Patrick Casher (FIT-Foxconn)
Location: Ballroom D
Track: 06. System Co-Design: Modeling, Simulation & Measurement Validation, 13. Modeling & Analysis of Interconnects
Format: Panel Discussion
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – Test on Wheels: Test & Measurement for Automotive Standards
Moderator: Julien Henaut (BitifEye Digital Test Solutions GmbH)
Panelists: Edo Cohen (Valens), Ajeya Gupta (Ford Motor Company), Kevin Kershner (Keysight Technologies), Dr. Kirsten Matheus (BMW Group), Laxman Vemury (Analog Devices), Shawn Prestridge (IAR Systems)
Location: Ballroom C
Track: Drive World - Advanced Automotive, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : Automotive
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Panel – What is Needed for 224Gbps? System & Chip Vendors Perspective
Moderator: Cathy Liu (Broadcom Inc.)
Panelists: Srinivas Venkataraman (Facebook), Pirooz Tooyserkani (Cisco Systems, Inc.), Richard Ward (Astera Labs Inc), Pervez Aziz (Nvidia)
Location: Ballroom H
Track: 09. High-Speed Signal Processing, Equalization & Coding/FEC, 07. Optimizing High-Speed Link Design
Format: Panel Discussion
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Speaker: Seonguk Choi (KAIST)
Authors: Minsu Kim (KAIST), Joungho Kim (KAIST), Hyunwook Park (Korea Advanced Institute of Science and Technology), Jihun Kim (Korea Advanced Institute of Science and Technology, KAIST), Seongguk Kim (Korea Advanced Institute of Science and Technology), Keunwoo Kim (Korea Advanced Institute of Science and Technology), Kyunguk Kim (Samsung Electronics), Haeyoen Rachel Kim (KAIST), Joonsang Park (Korea Advanced Institute of Science and Technology), Keeyoung Son (Korea Advanced Institute of Science and Technology), Daehwan Lho (Korea Advanced Institute of Science and Technology), Jiwon Yoon (Korea Advanced Institute of Science and Technology), Jinwook Song (Samsung Electronics), Jonggyu Park (Samsung Electronics)
Location: Chiphead Theater
Track: Chiphead Theater, 01. Signal & Power Integrity for Single-Multi Die, Interposer & Packaging
Format: Lightning Talk
Theme : High-speed Communications
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Risks & Enablers of Server Platform Design in Immersion Cooling
Speaker: Shaohua Li (Intel)
Authors: Dan Liu (Alibaba), Yangfan Zhong (Alibaba), Honghao Cao (Alibaba), Yunhui Chu (Intel), Kai Wang (Intel), Haifeng Gong (Intel), Tina Bao (Intel)
Location: Chiphead Theater
Track: Chiphead Theater, 13. Modeling & Analysis of Interconnects
Format: Lightning Talk
Theme : Data Centers, Infrastructure
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Location: Expo Floor
Track: Networking Session
Format: Networking Session
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
Electrothermal Co-Simulation for PCB and Package Designs Using Celsius Thermal Solver
Speaker: Karthick Gopalakrishnan (Cadence)
Location: Mission City Ballroom B5
Track: Sponsored Session
Format: Sponsored Session
Education Level: All
Pass Type: 2-Day Pass, All Access Pass, Expo Pass
